ASMPT Process Expert SPI System

  

SMT lines learn and optimize themselves


The Process Expert is the world’s first self-learning inline expert system for electronics manufacturing.

In perfect interaction the expert system Process Engine, the high performance SPI Process Lens and the DEK stencil printer form the complete Process Expert pre-placement solution

Its first component is the Process Lens, our innovative high-precision 5D-SPM (Solder Paste Measurement) system (3D + 2D) that employs a chip with 8 million software-controlled micro-mirrors.

Its second component is the state-of-the-art Process Engine real-time software, which uses big-data technologies to analyze all current and historical sensor data, learns from the results, and uses them to improve the solder paste printing process.

Only our Process Expert can do this:

  • DFM HealthCheck:
    By running “virtual prints” based on the stencil data and its exhaustive and industry-unique process knowledge database, the Process Expert recommends the best process and printing parameters for a given layout and identifies critical areas in the stencil layout that may create larger printing variations. The user can use other process parameters and see their consequence on the stability of the printing process promptly.
  • Fast NPI with “fractional experiments”:
    When new products are introduced, Process Expert takes only a few minutes to determine optimized printing parameters and ensure an optimized printing process within a very short time.
  • Permanent and pro-active optimization:
    Process Expert checks the printing results, optimizes the printing process, and continuously and proactively controls the printing process, for example by adjusting the cleaning cycles and correction of print offset on the printer.
  • Your gain:
    Stable printing processes, significant time savings, lower costs, better yield, and a much more productive line with less operator interventions.

The most Innovative measurement system
Moiré phase shifting with 8 or 20 million digitally controllable micromirrors
Maximum accuracy
Precise X/Y positioning, combined 2D/3D measurements and on-the-fly compensation of board warpage
Shadow-free
Multiple light sources
Comprehensive
Visualization of position, area, height,volume and shape of all solder deposits; checks for coplanarity and bridging
Maximum throughput
Inline measurement in single or dual-conveyor mode
Easy operation
Quick programming with component library and recommendations of inspection criteria
Investment protection
Software-upgradeable to Process Expert inline expert system for autonomous process optimization